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Dialog Improves System Performance

Non-volatile memory (NVM) is a key component at the heart of every system design. It holds critical data, controls how the system boots, and affects overall performance. Choosing the right NVM is key. We’re here to help. Our wide range of NVM products offer an array of features designed to help tune and optimize your system.

Octal xSPI Memory


xSPI (8x SPI)

High bandwidth

Low power

eXecute-in-Place (XiP)



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Dual / Quad SPI Memory


SPI, Dual, Quad

1.8V, 3.0V. Wide VCC

Ultra-low Energy, Low Power

7nA sleep

Battery monitor


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DataFlash SPI Memory

Fast Flexible Robust

Concurrent programming

Easy to use

Power fail protection

Data integrity

Low power modes


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Wafer KGD

Known Good Die program

Up to 125°C operating temperature

All voltage levels

  • 1.8V
  • 3.0V
  • Wide Voltage 1.65V to 3.6V

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Verified Memory for NXP

Low Power and high-speed SPI Flash solutions for NXP i.MX RT MCUs

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Verified Memory for ST Microelectronics

Dialog SPI Flash solutions verified on over 30 STM32 MCUs

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CBRAM Technology

CBRAM is a resistive RAM technology that provides power, speed, and cost benefits over other non-volatile memory technologies. It is well suited for battery powered devices, edge computing, and AI applications.

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1 week ago

AT25PE20‐SSHN‐T Reflow Solder Profile

Posted by AHHoefer 25 points 1 reply


Is there a recommended reflow profile specified by Dialog for the AT25PE20‐SSHN‐T? Specifically the time that can be spent at peak temperature and number of reflow cycles the part can withstand.

Thank you.

accepted answer!

1 week ago

gordonmacnee 25 points

We use the JEDEC standard profile as specified in J-STD-020D.1 for all of the Flash memory devices. 

The max temp must be < 235degC

and for lead free process the time above 217degC should be between 60-150 secs.

I understand that this is a 'standard' profile for small SM components and the device will survive >3 cycles with out any change to datasheet specs.