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| Control Number | Title | Type | Date Issued |
|---|---|---|---|
| PCN052 | End of Life AT25SF161 | EOL | Feb 12, 2021 |
| PCN051 | End of Life AT25SF081 | EOL | Feb 12, 2021 |
| PCN050 | AT25SF128A-CCUB-T Discontinued | EOL | Oct 7, 2020 |
| PCN049 | End of Life of RM24XX, RM25XX and RM3xxx SPI & I²C EEPROM | EOL | Aug 24, 2020 |
| PCN048 | AT25SF041 End-of-Life | EOL | Jun 17, 2020 |
| PCN047 | Smart Server IoT Pro Hardware Modification | Change | Jul 1, 2020 |
| PCN045 | Capacity Expansion Greatek Taiwan for Wide and Narrow SOIC Packages | Change | Apr 6, 2020 |
| PCN044 | Manufacturing Capacity Expansion; narrow .150″ SOIC device package | Change | Feb 14, 2020 |
| PCN042 | AT25SF321 End-of-Life | EOL | Aug 5, 2019 |
| PCN041 | DataFlash AT45DB321E and AT45DQ321 Yield Improvement | Change | May 23, 2019 |
| PCN040 | Yield Improvement; 1 layer mask change AT45DB161E and AT45DQ161 products | Change | Apr 30, 2019 |
| PCN039 | Wafer Probe Test Equipment Transfer | Change | Jan 28, 2019 |
| PCN038 | Wafer Probe Facility Addition Teraprobe | Change | Jan 28, 2019 |
| PCN037 | WLCSP Assembly Location Addition PTI | Change | Jan 28, 2019 |
| PCN036 | AT25DF641A & AT45DB641E | Change | Oct 14, 2018 |
| PCN035 | BGA package of serial flash | EOL | Mar 28, 2018 |
| PCN034 Addendum | PCN034 Addendum | Change | May 15, 2018 |
| PCN034 | Capacity Expansion for the .150″ Narrow SOIC Product Package | Change | Mar 8, 2018 |
| PDF033 | 64-Mbit Standard Serial Flash® (AT25QF641) – Product Improvement Changes | Change | Nov 28, 2017 |
| PDF032 | Manufacturing Capacity Expansion for the 8-contact, 6 x 8mm VDFN Package | Change | Aug 1, 2017 |
| PDF031 | AT25DL081-UUN-T and AT25DL161-UUN-T End of Life | EOL | May 30, 2017 |
| PDF030 | Addition of UMC 8S Wafer Fabrication Facility for All AT25DF321A Products | Change | Jun 29, 2017 |
| PDF029 | 8-Mbit DataFlash® (AT45DB081E) – Yield Improvement | Change | May 5, 2017 |
| PDF028 | 4-Mbit DataFlash® (AT45DB041E) – Yield Improvement | Change | Feb 15, 2017 |
| PDF027 | 2-Mbit DataFlash® (AT45DB021E) – Yield Improvement | Change | May 2, 2016 |
| PDF-SF026 | Capacity Expansion for the .208” Wide SOIC Product Package | Change | Apr 6, 2016 |
| PDF023 | 1Mbit Serial Flash AT45DB011D End of Life | EOL | Feb 10, 2015 |
| PDF-SF022 | Capacity Expansion for the UDFN Product Package | Change | Jan 16, 2015 |
| PDF021 | 64-Mbit DataFlash® (AT45DB641E) Wafer Manufacturing Plant Addition | Change | Oct 30, 2014 |
| PDF020 | Limited PCN (Customer Specific) – AT45DB011D-xxHGK EOL for parts with CAN Code HGK | EOL | Mar 5, 2014 |
| PSF017 | 32Mbit Serial Flash AT25DQ321 End of Life | EOL | Jan 16, 2014 |
| PSF016-A | 4-Mbit Serial Flash – Alternate Part Number Correction to PSF016 | EOL | Apr 17, 2014 |
| PSF016 | 4Mbit Serial Flash AT25DF041A End of Life | EOL | Jan 16, 2014 |
| PSF015 | 64Mbit Serial Flash AT25DF641 End of Life | EOL | Jan 16, 2014 |
| PSF014-B | 512kbit Serial Flash – Revised Replacement Part Number and MSL Rating | EOL | Jul 08, 2014 |
| PSF014-A | 512kbit Serial Flash – Part Number Addition to PSF014 | EOL | Mar 11, 2014 |
| PSF014 | 512kbit Serial Flash (AT25F512B and AT25BCM512B) URGENT QUALIFICATION REQUIRED due to LFoundry Closure (No LTB Date) | EOL | Jan 16, 2014 |
| PDF013-A | 32-Mbit DataFlash® URGENT QUALIFICATION REQUIRED due to LFoundry Closure (No LTB Date) | EOL | Jan 16, 2014 |
| PDF013 | 32-Mbit DataFlash® (AT45DB321D) Process Geometry Shrink and Device Enhancement (Replaced by PDF013-A) | EOL Ext. | Oct 31, 2013 |
| PDF012-A | 8-Mbit DataFlash® URGENT QUALIFICATION REQUIRED due to LFoundry Closure (No LTB Date) | EOL | Jan 16, 2014 |
| PDF012 | 8-Mbit DataFlash® (AT45DB081D) Process Geometry Shrink and Device Enhancement (Replaced by PDF012-A) | EOL Ext. | Oct 31, 2013 |
| PDF011-A | 4-Mbit DataFlash® URGENT QUALIFICATION REQUIRED due to LFoundry Closure (No LTB Date) | EOL | Jan 16, 2014 |
| PDF011 | 4-Mbit DataFlash® (AT45DB041D) Process Geometry Shrink and Device Enhancement (Replaced by PDF011-A) | EOL Ext. | Oct 31, 2013 |
| PDF010-A | 64-Mbit DataFlash® URGENT QUALIFICATION REQUIRED due to LFoundry Closure (No LTB Date) | EOL | Jan 16, 2014 |
| PDF010 | 64-Mbit DataFlash® (AT45DB642D) Process Geometry Shrink and Device Enhancement (Replaced by PDF010-A) | EOL | Oct 24, 2013 |
| PDF009 | 8-Mbit DataFlash® (AT45DB081D) Process Geometry Shrink and Device Enhancement | EOL | Sep 10, 2013 |
| PDF008 | 32-Mbit DataFlash® (AT45DB321D) Process Geometry Shrink and Device Enhancement | EOL | Aug 21, 2013 |
| PDF007 | 4-Mbit DataFlash® (AT45DB041D) Process Geometry Shrink and Device Enhancement | EOL | Aug 21, 2013 |
| PDF006 | 16-Mbit DataFlash® (AT45DB161E) Wafer Manufacturing Plant Addition | PCN | Jun 20, 2013 |
| PDF-SF005 | Adesto® Products – Wafer Probe Test Site | PCN | Jan 29, 2013 |
| PDF-SF004 | Adesto® Serial Flash & DataFlash® Products Package Marking Change | PCN | Dec 26, 2012 |
| PDF-SF003 | Special Lot Flow SL551 Discontinuance | EOL | Sep 30, 2013 |
| PDF002 | 2-Mbit DataFlash® (AT45DB021D) Process Geometry Shrink and Device Enhancement – REVISED | EOL Ext. | Dec 7, 2012 |
| PDF001 | 16-Mbit DataFlash® (AT45DB161D) Process Geometry Shrink and Device Enhancement – REVISED | EOL Ext. | Dec 7, 2012 |
| AD011014 | Critical Update Regarding Adesto Technologies Products Manufactured at LFoundry-Rousset | Letter | Jan 10, 2014 |
| SC120701 | 8-Mbit Serial Flash (AT25DF081, 1.65V to 1.95V) Process Geometry Shrink | EOL | Mar 6, 2012 |
| SC124101 | Atmel Sale of Serial Flash Product Family to Adesto | PCN | Oct 12, 2012 |
| GUIDE | Adesto DataFlash ‘D’ to ‘E’ Series Conversion Chart | GUIDE | Jan 21, 2014 |