Industrial ASICs
Custom ASICs meet highest functional safety & reliability requirements
The Industrial Internet of Things or Industry 4.0 is driving some of the most complex networking and electronic system solutions in the world today. Our high-performance mixed-signal ASICs, embedded with microprocessors, memory and connectivity, connect the physical world to the cyber world.
Benefits
Benefits Over Discrete Design
Differentiated Solutions – differentiate your product from the competition through integration
Optimized Performance – meet your performance requirements without having to make any trade-offs
Smallest Size – achieve up to 75% reduction in die size through integration
IP Protection – integrate your proprietary IP into silicon making it secure
Designed to Industry Standards – whatever standards you need to meet, can be achieved as part of the design & manufacturing process
Function Safety – ASICs designed to ISO 26262
Improved Reliability – reducing your bill of materials through integration means less components to place and thus improved reliability
Security of Supply – ownership of the design gives better security of supply
Complex Application Specific ICs (ASICs) Secure your IP & Improve Performance
Complex specific systems in industrial and automation technology often require tailor-made semiconductor solutions. The additional implementation of modern processor cores and the use of varying memory blocks, sensors and I/O generate entire systems-on-chip (SoC). We give our customers a decisive and competitive advantage by providing bespoke, high quality, high-performance ASIC design without compromising on cost and time-to-market. Our proven design, development, and operations flow has successfully delivered time and again high volume ASICs to the most demanding customers in the world.
Our ASIC products operate in the most challenging markets requiring the highest quality standards. Dialog has been developing and supplying ASICs for over two decades. We take into consideration throughout the design and production process all necessary standards for certifications required for our customer and their market.
We work closely with our customers from concept through to supply to ensure we deliver on time, every time. Please contact us to discuss your requirements.
Blending Analog and Digital
We have a large library of silicon proven IP available for use in our ASICs and design expertise focused on combining analog circuits with complex digital processors. We’ve been doing this successfully for decades, so you can be confident that your entire system will be optimized.
"Security First" Design Philosophy
While security is a growing concern, it’s often considered too late in the design process. Our Security First philosophy means we design in security at the very start.
IP Portfolio that Accelerates your Design
Our silicon-proven IP fast-tracks ASIC development
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Get in touch with us directly through our worldwide sales offices, or contact one of our global distributors and representatives.
Inquiries Distributors and Representatives Register for newslettersEnabling your product vision with custom ASICs
Tech Series: Industrial ASICs
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Get in touch with us directly through our worldwide sales offices, or contact one of our global distributors and representatives.
Inquiries Distributors and Representatives Register for newslettersAdvanced Industrial Bus Controller
Features
3 x 250 MBit/s PHY with extended common mode range
Integrated openMSP430 CPU subsystem with 64 kB Flash and 64 kB RAM
Combined LDO/buck converter for 1.2V core voltage
IO ADCs (3x10bit) and IO DACs (16 x 2 MS/s, 2x100 kS/s)
PLL with and without spread spectrum
External micro controller interface
LED matrix outputs
Package BGA-100, pitch 0.8 mm, 9x9 mm
Benefits
PHY with low and constant latency
Flexible IO configuration for digital interfaces or analog sensors
3 PHY instances allow various network topologies
PHYs contain clock and time stamping unit
Applications
Decentral IO modules
Industry 4.0
Machine to Machine communication
Fieldbus for realtime communication
Differential Current Measurement (Electrical Safety)
Features
0,35 µm HVCMOS process
Supply voltage monitoring (POR)
10-Bit DAC
SPI interface
Supply of the transformers
Can be used for EV charging cables
Benefits
Measurement rate up to 5 k samples/sec
On-chip clock generation of 12 MHz with fast start-up for external µC
External 32 kHz quartz as timing reference
12 Bit resolution
Error monitoring
Integrated function test
Programmable gain & offset
Included DC/DC converter
Applications
AC and DC residual current monitoring in
Industrial automation
High tech charger
Assembly lines
DSRC Baseband ASIC for Toll Collection
Features
Compliant with DSRC-standard
Support for 1.5MHz and 2MHz subcarrier
Operation in Half-Duplex-mode
Automatic wake-up on DSRC-preamble
Few external components
High-speed SPI-interface to external controller
Power-management for external controller (on-chip- LDO)
On-chip clock-generation with fast startup
32kHz-xtal-osc as timing-reference
Benefits
Ultra-low-power standby-mode
DES algorithm in hardware
On chip battery backed 8kB-SRAM accessible via SPI
Applications
On board unit for electronic toll collection
FPGA ASIC Conversion
Features
Single-chip solution with integrated CPU and NVM (for example flash or EEPROM)
Power reduction (3-4x)
High quality due to customized test
Low-cost drop-in replacement
Enhanced performance
Long-term availability
Benefits
Cost reduction
Size reduction
Best fitting technical solution
Applications
Replacement of all FPGA-applications with high series production volumes running under a stable technical specification for long product lifetime.
LCD Matrix Driver
Features
0.8 µm HV-CMOS process
Selectable static or muxed LCD driver
Programmable mux mode (2x38, 4x36 oder 8x32 pixels)
Drives up to 40 segments in static mode
Dual RAM for display storage addressable as 8 x 40 words
LCD blanking by BLANK bit and STR signal
All segments on by SET bit
On chip LCD bias voltage generation
CSP with gold bumps
Benefits
Chip scale package
Chip on glass mountable
Applications
LCD matrix displays
Optical Sensor ASIC for Distance Measurement
Features
Integrated photo diode line array with TIA pre-amps
High speed/accuracy laser diode driver
High speed 8 Bit-ADC
Digital signal processing for distance measurement
Optical clear chip scale package (TSV)
High sensitivity
Anti-reflective coating
Benefits
High ambient light suppression
Smallest package, CSP with TSV technology
Anti reflecting coating
Applications
Industrial optical distance sensor
Position Sensor ASIC
Features
Inductive position sensor ASIC
36V IO-Link compliant switching unit for resistive and inductive loads
Integrated 16-bit microcontroller running fully featured IO-Link device stack
Temperature compensation of detection point
Reverse polarity protection
Short circuit protected
Measurement principle selectable (ping mode or oscillator mode)
Benefits
Complete System on Chip
Embedded µC
Royalty free solution
Embedded IO-Link interface
Applications
Industrial position sensor application
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