DA14531 Hongjia HJ-531IMF

DA14531 Hongjia HJ-531IMF

A team of engineers is ready to answer your questions

Tangshan HongJia Electronic Technology Co., Ltd. has developed a ultra-small, ultra-low power Bluetooth 5.1 SIP module with Dialog’s SmartBond DA14531 TINY, the world’s smallest and most power-efficient Bluetooth 5.1 SoC. The HJ-531IMF with built-in high-performance antenna comes in the size of 5 x 4.75 x 1.3mm in a LGA25 package.

Features

  • Size: 5 x 4.75 x 1.3mm
  • Package: LGA25
  • GPIOs: 12
  • Supply voltage: 1.1V-3.6V
  • TX < 3.5mA; RX < 2.2 mA
  • Built-in high-performance antenna (External antenna can also be used)
  • On-board antenna range: 5-10m; External antenna range: 40-80m
  • Support BLE 5.1, support WeChat and user develop
  • Built-in 1Mb FLASH, support OTA, Store user data
  • Operating temperature: -40℃ to +85℃

Applications

  • Tiny medical applications
  • Beacons
  • Smart toys
  • Smart locks
  • Remote  Controls
  • Industrial smart devices

Ordering information

Resources

Datasheet
Date Version
DA14531 Hongjia HJ-531IMF Datasheet 12/05/2020 1.2

Every quarter, we bundle up the best technical info on our products, software development topics, trainings, events and deliver it to your inbox.

Register for the SmartBond newsletter