SmartBond DA14530 and DA14531
The world’s smallest and lowest power Bluetooth 5.1 System-on-Chip
The SmartBond TINY™ DA14530 and DA14531 are the Bluetooth® low energy solution to power the next 1 billion IoT devices
SmartBond TINY™, the world’s smallest and lowest power Bluetooth 5.1 System-on-Chip, brings down the cost of adding Bluetooth low energy in any system to $0.50 in high volumes.
This awesome combination takes mobile connectivity to places previously out of reach, triggering a wave of a billion IoT devices, all with SmartBond TINY at the heart.
The low system cost is achieved through the high level of integration in SmartBond TINY: a complete Bluetooth low energy system can be achieved with the addition of 6 tiny external passives, a crystal and power source. And to lower the barrier of entry, SmartBond TINY will also be available in an easy-to-use tiny module incorporating all the needed components, making the addition of Bluetooth low energy to any application a simple drop-in.
Record low hibernation and active power consumption ensure long operating and shelf life with even the tiniest, disposable batteries. Based on a powerful 32-bit arm Cortex M0+ with integrated memories and a complete set of analog and digital peripherals, SmartBond TINY is extremely power efficient, delivering a record score of 18300 on the latest EEMBC benchmark for IoT connectivity, IoTMark™. Available in a tiny 2.0 x 1.7 mm package, the DA14531 is half the size of its predecessor, or any offering from other leading manufacturers. And it is complemented by a flexible SDK supporting major compilers such as Keil and GCC out of the box. The DA14530 is pin for pin compatible with DA14531 in a 2.2x3.0mm FCGQFN24 package and provides cost savings by operating from an internal LDO, eliminating the cost of a DC-DC inductor.
Future proof, compliant with Bluetooth 5.1 (core)
Optimized for disposable products in connected medical, connected consumer
- Designed to work with disposable, even printed batteries
- Works well with smallest capacity batteries, <<30mAh
- Supports multiple years of shelf life
- Inrush current can be limited for disposable batteries with high internal resistance
- Package design allows for low cost manufacturing with smallest possible footprint
Only requiring a single 32MHz crystal
In bypass mode no DC-DC inductor required
No boost converter required when working with 1.5V batteries
Production Line Tool for accelerated production ramp up, resulting in faster time to market and shortest production test time per device
Beacons, Smart labels, Remote controls, Proximity tags, Connected watches, Stylus pens, Mouse, Toys, Low power sensors, Bluetooth LE add on “BLE pipe” to existing applications
Connected injectors, Inhalers, Glucose monitors, Smart patches, Blood pressure meters, Thermometers
Tire Pressure, Monitoring Systems and low power wireless sensors
DA14531 product overview video
Production Line Tool Kit Webinar
MikroBUS Click Board Webinar
|DA14531 / SmartBond TINY Module||
||Buy now from Digikey
Buy now from Avnet
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|DA14531 Hongjia HJ-531IMF||
|DA14531 Honjia HJ-131IMH||
DA14530 and DA14531
2 months ago
Multiple files, which contain SPI_DI_PIN macro (#define)Posted by joachimkr 20 points 4 replies
I am in hardware verification for an own board, being home for a DA14531 and some SPI hardware.
During this process I needed to define, where my SPI interface pads have to be.
Here is, what I understood:
During a flash memory boot, the Pin 1 of Port 0 is the CS (chip select) for a flash memory. I need this flash memory. Currently, I never burned content, but debugged with the segger chip interface.
For my peripheral, I therefore needed to use a different port pin, to get a working CS for that. I used pin 7. Because my peripheral is compatible to the macronix flash, I can use the same polarities and frequency, no trouble.
Now, during verification, I came into some trouble and tried to use a different port pin. What popped up was, that I find 3 locations in the 'BLE peripheral' example file set, where Pins are mapped by using macros and I get into trouble to understand that.
I found these three files to contain a macro set for defining pads for SPI_EN, SPI_DI, SPI_DO,SPI_CLK pins :
Initially, the CS was defined to be Port 0 Pin 1 and I just changed that to pin 7, in order to get my debugging job done.
But now, I need to really understand the steps and usage. So at first, I am confused, where I need to set the #define macro to set the used pin.
During boot, I understood (is it correct?) the CPU uses CS on pin 1 and I can expect flash content is copied to RAM and executed. I cannot alter that, so I wired this CS from flash to port pin 1.
During my program run, I need port pin 7 to be used for my peripheral.
But what, if I need to write something to flash during program run? I have just one macro name but 3 locations, where this is defined.
What I saw, looked like a use of this pin number to be written to some structure, which is used by the SPI driver.
Please explain to me, what is the correct way, to define a second device, using a different pin then pin 1 as CS. How can I switch between devices?
I would be lucky, to finally understand that,