February was stacked with major events for Dialog. We recently told you about how we traveled to Barcelona at the end of the month for Mobile World Congress, but that’s not all we had on tap. We also ventured to Nuremberg, Germany, from February 27 to March 1, for Embedded World 2018.
As the name implies, Embedded World is one of the world’s premier hotspots for all things embedded systems, particularly for the IoT. Thousands of exhibitors and tens of thousands of attendees, all hailing from dozens of countries, flocked to the show floor at Nuremberg, making Embedded World one of the best places Dialog can be to showcase our industry-leading solutions and meet with other industry leaders to accelerate the pace of innovation.
Here’s the lineup of innovations we had on hand to demonstrate at this year’s Embedded World:
GreenPAK Development Environment
Our GreenPAK Designer development software helps to create a simple mixed signal chip design wherein designers can configure, program and test custom-made GreenPAK prototypes – within hours. Better still, designers can pull this off without needing a compiler or being an expert in either programming or transistor level design.
At Embedded World, attendees had the chance to see the intuitive development environment created by the GreenPAK Designer in action, including: how easily its components can be configured; how the component library highlights resource allocation availability for devices; its schematic capture-like design and routing capability; and, some examples of projects and support documentation produced within the GreenPAK development environment.
SmartBond™ DA14585 IoT Sensor Development Kit
Our SmartBond IoT Sensor Development Kit helps to accelerate IoT development through a cutting-edge combination of Bluetooth™ low energy (BLE) hardware (including support for Bluetooth® 5 and BLE Mesh), sensors and sensor fusion software. Altogether, this makes developing motion and environmental sensing applications considerably easier, via the world’s lowest-power 12 degrees of freedom wireless sensor module.
We developed this kit based on Bosch Sensortech sensors, which combines Bluetooth low energy transmission capabilities with an ARM Cortex-M0 processor, an accelerometer, a gyroscope, a magnetometer and an array of environmental sensors. The end result is a highly integrated board that cuts down on system size and costs, includes all essential software and hardware needed for expediting advanced IoT device creation, and does so all on a mere 16 x 15 mm board. Additionally, with 96kb of RAM, the DA14585 boasts twice as much memory as its predecessor and a wide supply voltage range of 0.9 – 3.6 V for greater design flexibility.
If you weren’t able to make the show, don’t worry – we’ve got plenty more to talk about on GreenPaK and IoT sensors all throughout 2018, so stay tuned! And, check out our blog posts on CES and Mobile World Congress for a rundown on what we’ve been showcasing at the other big shows of 2018 so far.