
We are seeking a highly motivated Product Engineer to strengthen our Group in Germany. The function comprises the installation, monitoring and improvement of product yield and quality in high volume IC manufacturing.
The successful candidate requires several years of experience in high volume IC manufacturing in one or more of the following fields: product engineering, wafer process development/integration, assembly engineering or test program development. The candidate has experience in working and leading international and cross-functional teams. Fluent written and verbal English is essential. This position is located in Kirchheim unter Teck-Nabern, Germany (near Stuttgart).
If you feel you have the experience and enthusiasm to join us at this exciting time in our development, then please send us your CV or resume by e-mail, stating the position you wish to apply for, and your current salary to: Rachel Dainton, Worldwide HR Director at jobs@diasemi.com - or you can send your CV to ‘Human Resources Department’ at any of our Office addresses.